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Features
■ Special alloy resistor
■ Power rating at 70 °C: 3 W
■ Inductance less than 5 nH
■ RoHS compliant*
CRA2512 - High Power Current Sense Chip Resistor
Electrical Characteristics
Recommended Solder Pad Layout
Characteristic
Power Rating @ 70 °C
Operating Temperature Range
Derated to Zero Load at
Maximum Working Voltage
Insulation Resistance
Resistance Range
CRA2512
3W
-55 °C to +170 °C
+170 °C
(P x R) 1/2
> 100 megohms
0.010 - 0.100 Ω
Cu TRACE
L
B
SENSING TRACE
A
Resistance Tolerance
±1 %, ±5 %
Model
A
B
L
Temperature Coef?cient
±75 PPM/°C
CRA2512
4.0
(0.157)
2.1 4.1
(0.083) (0.161)
Performance Characteristics
DIMENSIONS:
MM
(INCHES)
Test
Conditions
Speci?cation
Thermal Shock
Short Time Overload
Low Temperature
Storage
High Temperature
Exposure
Bias Humidity
Mechanical Shock
Vibration
Load Life
Resistance to Solder
Heat
Moisture Resistance
-55 ?C to + 150 ?C,
1000 Cycles, 15 minutes
5 X Rated Power for 5 seconds
-55 ?C for 24 hours
1000 hours @ + 170 ?C
+ 85 ?C, 85 % RH, 10 % Bias,
1000 hours
100 g’s for 6 milliseconds, 5 pulses
Frequency varied 10 to 2000 KHz
in one minute, 3 directions, 12 hours
1000 hours at rated power at
+70 ?C, 1.5 hours on, 0.5 hours off
+260 ?C Solder, 10-12 second dwell,
25 mm/second emergence
MIL-STD-202 Method 106, 0 % power
(7a and 7b not required)
Δ R ±(0.5 % + 0.0005 Ω )
Δ R ±(0.5 % + 0.0005 Ω )
Δ R ±(0.5 % + 0.0005 Ω )
Δ R ±(1.0 % + 0.0005 Ω )
Δ R ±(0.5 % + 0.0005 Ω )
Δ R ±(0.5 % + 0.0005 Ω )
Δ R ±(0.5% + 0.0005 Ω )
Δ R ±(1.0% + 0.0005 Ω )
Δ R ±(0.5 % + 0.0005 Ω )
Δ R ±(0.5% + 0.0005 Ω )
Construction
Ni / Sn
Plating
Overcoat
Metal Alloy Plate
Product Dimensions
A
T
B
C
C
C
C
Model
A
B
C
T
Resistor
Material
CRA2512
6.45 ± 0.20
(0.254 ± 0.008)
3.35 ± 0.20
(0.131 ± 0.008)
0.95 ± 0.10
(0.037 ± 0.004)
0.7 ± 0.20
(0.0276 ± 0.008)
Resistor Cu-Ni
or Cu-Mn
DIMENSIONS:
MM
(INCHES)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Speci?cations are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their speci?c applications.
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